Mosaic Microsystems Honored with 3D InCites ‘Start-up of the Year’ Award
Leave a CommentMarch 22, 2022 — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, announced today that it is the recipient of the 2022 3D InCites Award for “Start-up of the Year.” In its ninth year, the 3D InCites Awards program recognizes industry-wide […]
See Mosaic’s article in the latest issue of Chip Scale Review!
Leave a CommentSee the article starting on page 37: https://chipscalereview.com/wp-content/uploads/flipbook/12/book.html
Empire State Development’s New York Ventures Announces $250,000 Investment in Rochester Based Mosaic Microsystems
Leave a CommentMOSIAC Microsystems (NY VENTURES) Final_2021-04-26
Mosaic Microsystems Wins STTR Award to Drive Development of Ultra-low Loss/High Gain Glass Based Radar Array Technology
Leave a CommentMosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through-glass vias (TGVs) for next-generation products in RF communications, has reported winning a Small Business Technology Transfer (STTR) Phase I award to collaboratively develop ultra-low loss solutions for next-generation radar arrays with the University of Florida. The award is sponsored by the […]
Mosaic Microsystems and Axus Technology are collaborating on thin glass wafer processing solutions
Leave a CommentAxus Technology (Axus), a leading global provider of CMP, wafer thinning and wafer surface processing solutions for semiconductor applications, is excited to be working with Mosaic Microsystems to build the supply chain for thin glass and through-glass via (TGV) processing and heterogeneous microelectronic packaging. Overcoming the challenges of handling, thinning, and cleaning <200 um thick […]
Mosaic Microsystems Demonstrates Process at 300 mm
Leave a CommentMosaic Microsystems is excited to have demonstrated our temporary bond process at 300 mm!
Mosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning
Leave a CommentMosaic Microsystems Secures $2 Million Seed Round from BlueSky Capital and Corning Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company, providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, particularly for 5G, as well as MEMS and sensors for the internet of things (IoT) has […]
Mosaic Microsystems Wins Two SBIR Awards to Support Technology Development Initiatives
Leave a CommentMicroelectronics and photonics packaging company receives funding to further accelerate technology roadmap Rochester, NY: — Mosaic Microsystems, a microelectronics and photonics packaging company providing thin glass substrates and through glass vias (TGVs) for next generation products in RF communications, has reported winning Small Business Innovative Research (SBIR) awards from the National Science Foundation (NSF) and […]